[TIE Award] Briefing sessions - Overseas
The Taiwanese government, Ministry of Science and Technology (MOST) and Ministry of Economic Affairs (MOEA) will co-organize the first “Tech Innovation Excellence Award (TIE Award)” to promote innovative applications of semiconductors in cutting-edge technologies.
*****Total Prize Pool Worth up to USD 109,000*****

We would like to invite International startups/ research institutions/ legal entities to showcase your innovative solutions that fits in the categories of AI & AIoT, Sensors, Communications, Smart Manufacturing, Autonomous Vehicles, New Energy, and others, to win cash prizes, a free booth at Taiwan Innotech Expo in October 2022, and opportunities to partner with Taiwanese semiconductor companies.

Time Schedule :
a. July 12th 17:00-18:00 (GMT+8)  Europe|Asia|Middle East|Australia
b. July 14th 09:30-10:30 (GMT+8)  North & South America

Register now to join our Online Briefing Sessions (July 12 & July 14) to learn more!

For more information about TIE Award:
https://www.futuretech.org.tw/futuretech/index.php?action=tieaward&web_lang=en-us 

Any questions?
Please contact: Christine Yeh
Chrisy@mail.tca.org.tw

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